Om Scientific Industry

Corporate

Nordiko is a technology company specialising in thin film process equipment for R, D & I and manufacturing. Nordiko enable innovation in new devices that impact all of our lives including 'phones, personal computing, TV and power generation. Nordiko aim to grow and deliver enhancements in magnetron and ion beam sputtering. Nordiko will always maintain integrity, foster collaboration and employee satisfaction.

Nordiko is a technology company specialising in thin film process equipment for R, D & I and manufacturing. Nordiko enable innovation in new devices that impact all of our lives including 'phones, personal computing, TV and power generation. Nordiko aim to grow and deliver enhancements in magnetron and ion beam sputtering. Nordiko will always maintain integrity, foster collaboration and employee satisfaction.

Front to Back Alignment Verification Double side alignment and exposure is frequently used in the manufacture of MEMS, power devices, integrated optics and PCBs. Top-to-bottom side Measurement Systems from SUSS MicroTec are the ideal tool to verify the alignment of your double side alignment and exposure processes.

Ordiko Were Pioneers In The Development Of Broad Ion Beam Process Systems For Magnetoresistive Random Access Memory (Mram) Applications. The Nordiko Mnem-Ix Was The First Production Tool Used In The Volume Manufacture Of Mram Devices. Designed For Precision Deposition Of A Mram Module As A Backend To A Standard Cmos Process Flow, The Mnem-Ix Benefits From Innovative Ion Beam Process Technologies. The Magnetic Storage Element Comprises A Stack Of Thin Layers Including Ferromagnetic And Antiferromagnetic Materials Used To Form A Free And Pinned Magnetic Layer That Are Separated By A Very Thin Barrier Junction. The Texture And Smoothness Of These Layers Are Critical In Achieving The Best Device Performance. The Low Pressure Operation For Film Deposition Combined With The Remoteness Of The Plasma Promotes The Formation Of Ultra-Smooth Films And High Integrity Thin Film Interfaces. The Unique Geometry Of The Deposition Module Configuration Allows Class Leading Within Wafer Non-Uniformity To Be Achieved. Precision Is Paramount And The Mnem-Ix Has A Track Record Of Achievement For Mram Production. Mnem-Ix Uses A Central, Industry Standard, Wafer Handling Platform. The Platform Can Be Equipped With Two 3600 Or 3800 Deposition Modules And Two Smaller 7000 Series Modules. The Latter May Be Used For Wafer Pre-Clean And Surface Modification.

The Imi Series Offers A Multifunctional Platform For The Study Of Physisorption, Chemisorption And Gas Absorption By Materials, From Entry Level Manometric Analyzers To Advanced Multistream Dynamic Flow Systems With Integrated Mass Spectrometry. These Versatile Instruments Can Satisfy The Demands Of A Diverse Range Of Applications, From Surface Area Determination To High Pressure Studies, From Gas Storage And Separation To High Pressure Catalysis Imi Series Key Features Fully Upgradable Modular Design Static And Dynamic Operational Mode Options Automatic Switching Between Static And Multistream Flowing Operation Multi-Gas Control Providing Programmable Sorbate Selection Versatile Instrument Control From Standard Methods To Complete User-Defined Experiments Adaptive Analysis Software Including End Point Detection For Sorption Processes, Reaction Kinetics And Sample Pre-Treatment Full Integration Of Mass Spectrometers From Hiden'S Quadrupole Range Enabling Sychronized Instrument Control And Data Acquisition

The Suss Microtec Mask Aligner Has Become Synonymous With Superior Quality, High Alignment Accuracy, And Sophisticated Exposure Optics. Suss Microtec Offers A Complete Range Of Mask Aligners For High-End Fab Automation, High Volume Production And R&D Environments Alike. Suss Microtec Designs Their Mask Aligner Systems For Lithography Applications In The Field Of 3D Packaging, Advanced Packaging, Mems, Led, Compound Semiconductors, Power Devices, Photovoltaic, Nanotechnology And Wafer Level Optics. Suss Microtec'S Mask And Bond Aligner Platforms Perform High Precision Alignment For Mask To Wafer As Well As Wafer To Wafer Operations. The Equipment Processes Substrates And Wafer Up To 300 Mm Of Any Kind Of Material And Thickness. With A Wide Variety Of Additional Functionality The Aligner Not Only Meets Various Process Requirements But Also Succeeds With Its Flexible Configuration Modes.

Each Introduction Of A New Technology Node Necessitates The Development Of Innovations In Photomask Processing. Suss Microtec Works In Close Cooperation With Customers, Technology Partners And Oems Suss To Completely Understand The Requirements Of Its Customers In Mask Shops And Wafer Fabs And To Deliver Solutions That Guarantee The Highest Level Of Mask Integrity. Suss Microtec’S Established Suite Of Photomask Processing Equipment Covers The Full Range Of Technology Nodes, Including Next-Generation Lithography Of 1X Half-Pitch Ranges From Stripping And Cleaning To Post-Exposure Bake And Developing Processes.

Veeco Provides The Industry’S Broadest Line-Up Of Innovative And Reliable Molecular Beam Epitaxy (Mbe) Systems. From The Most Proven System For Materials Research To The Silicon-Style Tools That Provide The Compound Semiconductor Industry’S Lowest Cost Of Ownership, Our Systems Deliver The High-Quality Material Needed, No Matter Budget, Application Or Growth Plans. Genxplor R&D Mbe System Gen10 Mbe System Gen200 Mbe System Gen20 Mbe System Gen2000 Mbe System Gen930 Mbe System Gen Ii Mbe System

Suss Microtec’S Wafer Bonding Platforms Combine More Than Sixty Years Of Microstructuring Experience With Solid Product Quality And A Broad Range Of Productivity Features. Partnering With Research, Academia And Material Suppliers We Develop Intelligent Solutions Which Offer Leading-Edge Technology For Our Customers. Our Platforms Cover Many Different Applications In 2.5D And 3D Integration, Mems, Led And Power Devices As Well As Other Area Of Research And Development.